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SIKAMA Falcon 8500 Reflow
Sikama’s 200mm reflow solder system is known as the Falcon 8500. Incorporating Sikama’s unique “thermal technology” based on conduction heating in combination with forced thermal convection, the 8500 has 1 load zone, 5 heat zones and 2 cooling zones. Each system includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines.
Prior to entering the heated zones, the temperature of the substrates is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/- 2 degrees C to ensure consistent and precise temperatures for reliable, repeatable profiles. The gas is introduced through tiny perforations in the conduction heating platens and enters the reflow chamber at the same temperature as that zone. The internal liquid-cooled zone(s) ensure a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone. The 8500 can be supplied to operate left to right or right to left (specify at time of ordering).
The system can be interfaced with a computer (customer supplied) for storing of profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. Sikama offers an optional Windows XP/Windows 7 based software package for use with the Falcon systems. Extra thermocouple installation is available as optional equipment for use with a temperature profiler.
The Falcon 8500 is well suited for wafer bumping applications (3-8 inch diameter wafers) as well as accommodating a broad range of substrate materials, high mass components and fixtures. In addition, the Falcon 8500 reflow oven is an excellent tool for curing epoxies, is a powerful, highly efficient, cost effective system with high production capabilities and designed to minimize your initial capital outlay and production costs, increase yields, safeguard your product integrity and improve your bottom line
Prior to entering the heated zones, the temperature of the substrates is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/- 2 degrees C to ensure consistent and precise temperatures for reliable, repeatable profiles. The gas is introduced through tiny perforations in the conduction heating platens and enters the reflow chamber at the same temperature as that zone. The internal liquid-cooled zone(s) ensure a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone. The 8500 can be supplied to operate left to right or right to left (specify at time of ordering).
The system can be interfaced with a computer (customer supplied) for storing of profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. Sikama offers an optional Windows XP/Windows 7 based software package for use with the Falcon systems. Extra thermocouple installation is available as optional equipment for use with a temperature profiler.
The Falcon 8500 is well suited for wafer bumping applications (3-8 inch diameter wafers) as well as accommodating a broad range of substrate materials, high mass components and fixtures. In addition, the Falcon 8500 reflow oven is an excellent tool for curing epoxies, is a powerful, highly efficient, cost effective system with high production capabilities and designed to minimize your initial capital outlay and production costs, increase yields, safeguard your product integrity and improve your bottom line
