Sikama International’s Falcon 1200TM is a multi-purpose furnace capable of temperatures up to 420°C that can be used as a reflow solder system as well as for epoxy curing applications. Incorporating Sikama’s unique “thermal technology” based on conduction heating in combination with forced thermal convection, the Falcon 1200TM contains 1 load zone, 7 heat zones and 2 cooling zones and includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines. The system may be operated with air, nitrogen or forming gas.
Prior to entering the heat zones the temperature of the substrate is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/-2°C to ensure consistent and precise temperature for reliable, repeatable profiles. The gas is introduced into the reflow chamber through tiny perforations in the conduction heating platens and enters the chamber at the same temperature set for each zone. The internal liquid-cooled zone ensures a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone.
Parts are transported through the furnace by sweeperbars that can operate continuously or in a “dwell” (timed delay) mode that is a unique feature offered only by Sikama and which produces superior temperature uniformity in the reflow profile. The Falcon 1200TM can be interfaced with a computer (customer supplied) for storing profiles, monitoring of individual heat zone temperatures as well as speed and time controls and remote operation. A tray to accommodate a laptop computer is supplied. Sikama offers an optional Windows® based software package. KIC ProphetTM thermocouple installation is available as optional equipment (does not include the KIC ProphetTM system itself.)
The Falcon 1200TM is well suited for reflow applications involving a broad range of substrate materials including wafer bump reflow, insulated metal-core substrates, BGA, high mass components and die soldering as well as epoxy curing applications including underfill and glob-top. The Falcon 1200TM’s efficiency of operation and minimal use of electricity and gas are the result of Sikama’s unique patented design for balanced heating and cooling that will increase your yields, improve your bottom line, and safeguard your product integrity and your reputation.