The Sikama UP1200 is a multi-purpose, continuous flow, SMT Reflow Soldering Oven capable of temperatures up to 400°C. The UP1200 can be used as a reflow solder oven as well as for epoxy curing applications. The UP1200 uses Sikama’s unique patented “thermal technology” that is based on contact conduction heating in combination with forced thermal convection heating and radiant heating of the work items.
The Sikama UP1200 Oven has eight (8) work zones internal to the oven: six (6) heat zones and two (2) cooling zones. In addition, there is a load zone and an unload zone. The heat and cool zones have both top and bottom heating/cooling elements. The heating and cooling zones utilize the Sikama contact thermal transfer for the bottom elements and combined convection and radiant thermal transfer for the top elements. The load/unload zones can operate in local mode or can be integrated into a flowing process using SMEMA connectivity to other process machinery. The system may be operated with cover gases such as nitrogen or forming gas. Each cooling and heating zone has independent temperature controls, permitting a complex thermal profile to be used in the reflow or curing process.
The Sikama UP1200 can be operated “stand alone” using the operator control panel on the front of the machine or it can be controlled using the Sikama Integrated Control Software running on a MS Windows PC computer. The computer is connected to the UP1200 via a RS232 interface cable.
The UP1200 utilizes Sikama International’s “walking beam” transport mechanism to move the work item from zone-to-zone through the oven. The walking beam mechanism lifts the work above the bottom contact heating zones and carries the work item to the next zone. The work item is not dragged or pushed, reducing the possibility of damage due to scraping or scratching.
Overall, Sikama’s Falcon UP1200 is a multi-purpose, stand alone, continuous SMT Reflow Soldering Oven with unique patented “thermal technology” and ten work zones.