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SIKAMA Wafer Bumping Line
For Wafer Bumping Line （WLCSP;CU;TSV;...Process )
The ongoing research and development conducted by the company in thermal technology has resulted in Sikama’s exclusive “Patented Heating Technology.” This technology was utilized in the development of the model Ultra Profile 2000 and Ultra Profile 4000 reflow ovens. These have broad areas of applications, and were specifically designed for “Ball Grid Array” technology. The 8000 series was developed for applications ranging from high mass applications to 200-mm wafer processing. The Falcon 1200 was a further enhancement of the 8000 Series, allowing for similar applications but with an increase in maximum substrate capabilities (up to a 12” x 12” part, including 300-mm wafers).
The next logical step was to build our own wafer flux coating system. The Falcon ICS412 was developed as an in-line belt flux coater/wafer washer capable of processing 4 inch to 300-mm wafers. The design offers a simple, robust, truly in-line system with the capacity to dispense up to 4 fluids.
As the wafer bumping technology has matured Sikama’s equipment has evolved to meet the demands of the technology, 300mm wafers are now the norm and the process requirements continue change.
Sikama’s UP1200 is the latest state of the art 300mm capable reflow oven and is an ideal platform for new products and process requirements.
Sikama has supplied special modifications and custom systems designed to meet specific customer requirements in addition to the standard systems. The vast thermal design and production experience available within the company can be a valuable resource in solving difficult production reflow soldering problems.
The ongoing research and development conducted by the company in thermal technology has resulted in Sikama’s exclusive “Patented Heating Technology.” This technology was utilized in the development of the model Ultra Profile 2000 and Ultra Profile 4000 reflow ovens. These have broad areas of applications, and were specifically designed for “Ball Grid Array” technology. The 8000 series was developed for applications ranging from high mass applications to 200-mm wafer processing. The Falcon 1200 was a further enhancement of the 8000 Series, allowing for similar applications but with an increase in maximum substrate capabilities (up to a 12” x 12” part, including 300-mm wafers).
The next logical step was to build our own wafer flux coating system. The Falcon ICS412 was developed as an in-line belt flux coater/wafer washer capable of processing 4 inch to 300-mm wafers. The design offers a simple, robust, truly in-line system with the capacity to dispense up to 4 fluids.
As the wafer bumping technology has matured Sikama’s equipment has evolved to meet the demands of the technology, 300mm wafers are now the norm and the process requirements continue change.
Sikama’s UP1200 is the latest state of the art 300mm capable reflow oven and is an ideal platform for new products and process requirements.
Sikama has supplied special modifications and custom systems designed to meet specific customer requirements in addition to the standard systems. The vast thermal design and production experience available within the company can be a valuable resource in solving difficult production reflow soldering problems.
